Cold Mounting (Embedding) UV Curing Resin Machine Metallography LCM-50

Introduction:

The cold mounting UV curing machine is used for the cold embedding (mounting) of metallographic samples using UV-curable resins. Its main purpose is to quickly cure transparent or colored embedding resins at room temperature under ultraviolet light, without the need for heating or pressure. This method is especially suitable for heat-sensitive samples or small, delicate components.

LCM-50 automatic UV curing machine is a cold-mounting machine that uses ultraviolet light to quickly cure resin. After pouring the resin into a specific cold-mounting mold and placing the workpiece, click Start to automatically and quickly cure to obtain a completely transparent mounted sample. The sample preparation is fast and does not contain bubbles, which can meet the needs of high-quality sample preparation.

Features:

(1) Automatic/electric opening and closing of the door;

(2) One-touch start, electric sample feeding and discharging;

(3) Touch screen control;

(4) The irradiation time can be freely set, and 4-speed timing is configured for one-touch access;

(5) Dual-light source ultraviolet light, full-angle irradiation;

(6) Achieve overall uniform curing;

(7) Low curing heat generation and high efficiency;

(8) The temperature at the end of curing and discharging is less than 60 degrees;

(9) Intelligent heat dissipation system;

Main functions and applications include:

Metallographic sample preparation: Encapsulating small or irregularly shaped specimens for easier grinding, polishing, and microscopic analysis.

Preserving fine structures: Ideal for samples that cannot withstand heat or pressure during traditional hot mounting.

Fast curing: Cures within minutes under UV light, significantly improving sample preparation efficiency.

Transparent embedding: Allows clear visibility of the sample’s surface and edges for accurate positioning and observation.

It is commonly used in material science laboratories, quality control, failure analysis, and electronic component inspection

Specification:

Packing List: